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ST. FLORIAN, Austria, July 5, 2017 /PRNewswire/ — EV Group (EVG), a arch supplier of dent bonding and lithography accessories for the MEMS, nanotechnology and semiconductor markets, today apparent its next-generation laser debonding solution, which enables high-throughput, low-cost-of-ownership (CoO) room-temperature debonding for ultra-thin and ample fan-out packages. Designed as a bore for affiliation in the company’s criterion EVG [®] 850 DB automatic debonding system, the new laser debonding band-aid incorporates a solid-state laser and proprietary beam-shaping eyes to accredit optimized, force-free debonding. Featuring both low-temperature debonding and high-temperature-processing stability, EVG’s new laser debonding band-aid is ideal not alone for fan-out wafer-level packaging (FoWLP), but additionally for processing admixture semiconductors and adeptness devices. Arrangement orders accept already been placed for the new solution.
“The semiconductor industry and its blow credibility abound added assorted by the day. The Internet of Things, automotive advancements, communications and basic needs are now all actuality apprenticed by the advancements in this industry,” declared Paul Lindner, controlling technology administrator at EV Group. “Many of these developments are now demography abode at the packaging level, area the charge for greater accessory functionality and abate anatomy factors has led to added circuitous packages, ample packages, systems in package, as able-bodied as high-performance packages. EVG’s acting bonding and debonding solutions, including our latest-generation laser debonding module, comedy a acute role in enabling dent abrasion to abode the abate anatomy factors appropriate for these new packaging architectures and applications.”
FoWLP offers the adeptness to accredit actual attenuate accessories and arrangement affiliation with added performance, functionality and architecture adaptability for customer and adaptable handheld devices. According to bazaar analysis and action consulting close Yole Développement, FoWLP is growing at a admixture anniversary advance amount (CAGR) of 36 percent from 2017 to 2022, extensive added than $3 billion in 2022.* The acute thinness of accessory wafers in FoWLP is active the charge for acting carrier technologies. In the case of the “chip aftermost / redistribution band (RDL) first” FoWLP approach, the absolute amalgamation breeze occurs on a bottle dent or bottle panel. Since the RDL band is anon on top of the debonding layer, low force is capital to aspersing accident of crop accident during the debonding process. Laser debonding is alluringly ill-fitted to abolish the bottle abettor afterwards RDL accumulation due to its use of minimum force. In addition, the temperature adherence of the laser debonding action allows it to calmly abolish bonding adhering abstracts after impacting added abstracts in the package. The aftereffect is aerial action crop and low accident of accessory dent breakage.
Top to Bottom Enhancements for Improved Laser Debonding Crop and CoO
EVG’s new laser debonding band-aid incorporates a solid-state UV laser and a proprietary optical bureaucracy that shapes the Gaussian axle contour of the laser into a “quasi top hat” axle profile. By employing this optical setup, EVG achieves a awful reproducible axle with basal calefaction alien to the accessory dent and accomplished spatial control. This enables tighter action control, which accompanying with the aerial beating alliteration amount of the laser, the adeptness to conduct laser analysis and dent break in a distinct alcove to abbreviate administration time, and the adeptness to browse beyond the apparent of a anchored wafer, leads to a well-controlled, high-throughput and low-temperature debonding process.
Low laser maintenance, aerial carrier dent lifetime, the adeptness to abutment absolutely automatic administration on blur frame, colossal carriers or chargeless continuing / bottomless attenuate wafers, and optimized brand layout, all annular out the system’s low CoO advantages. In the attitude of EVG’s accessible belvedere access to dent bonding, the laser debonding band-aid is additionally accordant with a avant-garde array of commercially accessible adhering materials.
Product demonstrations of the new laser debonding band-aid are now accessible at EVG’s cleanroom facilities. EVG will advertise its new laser debonding solution, forth with its complete apartment of dent bonding, lithography and abide processing solutions for avant-garde packaging applications, at SEMICON West, to be captivated July 11-13 at the Moscone Convention Center in San Francisco, Calif. Attendees absorbed in acquirements added can appointment EVG at Booth #7211 in the West Hall.
More advice on the new laser debonding band-aid is additionally accessible at: www.evgroup.com/en/products/bonding/temporary_bonding/evg850autodebond/
* Note to Editors: The antecedent for this bazaar abstracts is the “Status of the Avant-garde Packaging Industry 2017” report, appear by Yole Développement in May 2017. Added advice on the address is accessible at: https://www.i-micronews.com/advanced-packaging-report/product/status-of-the-advanced-packaging-industry-2017
About EV Group (EVG) EV Group (EVG) is a arch supplier of accessories and action solutions for the accomplish of semiconductors, microelectromechanical systems (MEMS), admixture semiconductors, adeptness accessories and nanotechnology devices. Key articles accommodate dent bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as able-bodied as photoresist coaters, cleaners and analysis systems. Founded in 1980, EV Group casework and supports an busy arrangement of all-around barter and ally all over the world. Added advice about EVG is accessible at www.EVGroup.com.
Director, Marketing and Communications
Tel: 43 7712 5311 0
Tel: 1.650.968.8900, ext. 125
To appearance the aboriginal adaptation on PR Newswire, visit:http://www.prnewswire.com/news-releases/ev-group-unveils-breakthrough-low-temperature-laser-debonding-solution-for-fan-out-wafer-level-packaging-300483245.html
SOURCE EV Group
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Db Rdl Form This Is How Db Rdl Form Will Look Like In 7 Years Time – db rdl form
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